3. Printable Semiconductors, Interfaces, and Manufacturing

Solution processing offers a pathway toward lightweight, flexible, large-area, and potentially low-cost electronic devices. However, converting a molecular or nanoparticle ink into a functional semiconductor film creates interfaces, grain boundaries, compositional gradients, residual disorder, and other structural features that can govern both initial performance and long-term reliability.

We study how coating conditions, microstructure, surface chemistry, and buried interfaces influence charge transport and defect evolution in perovskites, organic semiconductors, metal oxides, and nanocrystal solids.

Our characterization approaches include electrical measurements, optical spectroscopy, photoelectron spectroscopy, X-ray diffraction, and grazing-incidence X-ray scattering. These measurements connect atomic- and mesoscale structure to device behavior before, during, and after environmental stress.

This research provides the materials-processing foundation needed to translate radiation-resilient semiconductor concepts into scalable devices.